IC

Manufacture

Antenna

Manufacture

  Interposer

Manufacture*

Interposer

Assembly*

Inlay

Assembly

Card/Label

Conversion

• Wafer transport

• Die cutting

• Chip protection

• Inspection

• Printing

• Etching

• Wire Laying

• Hot foil

• Inspection

• Chip attaching

• Interposer label attaching

• Register lamination

• Hotmelt application

• Inspection

• Transfer adhesive

• Strap splicing

• Hotmelt application

• Rewinding

• Inspection

• Flip-Chip bonding

• Hotmelt application

• Chip protection

• Process monitoring

• Register lamination

• Customizing

• Application data

• Performance test

• Certified quality

  *Only in case of indirect chip assembly production flow