Each manufacturing process provides specific advantages. SECOBO® offers a list of benefits due to its unique Selective Copper Deposition process.

From Smart Label to ID-Card several applications or market segments can be addressed with this product. Different chip attach methods are available to find best fitting solutions regarding project specific requirements in durability and performance.  

• Performance at least according to application requirements

• High Interoperability

• Adhesiveless construction

• Selective build-up process - Cu thickness according to requirement

• Superior mechanical properties: flexible, metal to chip adhesion and overall durability

• High electromagnetic performance due to conductive track and cross-over

• No undercut effect

• Very sharp line resolution

• KURZ Certification to Quality Management System DIN EN ISO 9001:2000

• One step continuous web process up to 610 mm width

• Durable conductive track to cross-over linkage

• Chip Attach Yield: minimum loss

Certifications to

• New EU chemicals regulation REACH

• Environmental Management System DIN EN ISO 14001:2005

• KURZ EMAS - Verified Environmental Management